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Technical Capability
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Rigid PCB Capability |
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Item |
Standard |
Advance |
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Layers |
1-20 layers |
22-64 layers |
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HDI |
1+N+1&2+N+2&3+N+3 |
Any layer interconnection |
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Finger(Au) |
1-30U” |
30-50U” |
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Max Panel Size |
520*800mm |
800*1200mm |
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Min Panel Size |
5*5mm |
5*5mm |
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Board Thickness |
0.1mm-4.0mm |
4.0mm-7.0mm |
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Min Half Hole/Slot |
0.5mm |
0.3mm |
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Min. Line Width/Space |
3mil/3mil |
2mil/2mil |
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Min. Hole Size |
0.1mm |
0.075mm |
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Inner Copper Thickness |
0.5-4oz |
0.5-10oz |
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Outer Copper Thickness |
0.5-6oz |
0.5-15oz or more |
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Line Width |
±10% |
±5% |
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PTH Hole Size |
±0.075mm |
±0.05mm |
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NPTH Hole Size |
± 0.05mm |
±0.025mm |
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Hole Position |
±0.05mm |
±0.025mm |
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Outline |
±0.1mm |
±0.05mm |
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BoardThickness |
±10% |
±5% |
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Impedance Control |
±10% |
±5% |
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Bow and Twist |
0.75% |
0.50% |
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Board Material |
FR-4, CEM-3, Rogers, High TG,High Speed,High Frequency ,High Thermal Conductivity |
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Surface Finish |
HASL(with Pb free), Plated Ni/Au, ENIG, Immersion Tin, Immersion Ag, OSP,etc. |
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Solder Mask |
White, Black, Blue, Green, Grey, Red,Yellow, Transparent |
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Legend Color |
White, Black, Yellow etc. |
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Certification |
UL, IATF16949, ISO, RoHs&Reach |
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Email :
Sales@dqspcba.com
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